DPT Material

Due to delay of EUV(Extreme Ultraviolet) Lithography development and commercialization, chipmakers had to choose DPT(Double Patterning Technology) process for wafer patterning below 30nm. DPT process requires etch resistible layer materials such as DIPAS which is deposited on top of a processed resist material to form sidewall spacers.

PRODUCT

DIPAS

Diisopropylaminosilane

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E2S2

Bis(Diethylamino)silane

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