Etch Hard Mask Filem

Etch hard mask film materials is strongly required for wafer patterning below 70nm device. 1-Hexene and Propylene are deposited by CVD(Chemical Vapor Deposition) equipment and it forms ACL(Amorphous Carbon Layer). These hard mask have high etch resistance from high carbon content, it helps to define micro pattern on wafer.

PRODUCT

1-Hexene

1-Hexene

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4MS

Tetramethylsilane

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Propylene

Propylene

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