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63 [µ¿¾çÁõ±Ç] µð¿£¿¡ÇÁ, Áö±ÝºÎÅÍ ½ÇÀûÀ¸·Î º¸¿©ÁØ´Ù °ü¸®ÀÚ 07-08 19911
62 [HSBC] Korea Electronic Materials_Immune to demand woes (DNF¡¦ °ü¸®ÀÚ 08-27 19893
61 [Çϳª´ëÅõÁõ±Ç] µð¿£¿¡ÇÁ, ÀÌÁ¦ºÎÅÍ´Â ½Å±Ô °í°´ È®º¸°¡ °ü°Ç °ü¸®ÀÚ 09-25 19876
60 [¸Þ¸®Ã÷Á¾±ÝÁõ±Ç] µð¿£¿¡ÇÁ, DRAM Áõ¼³ ¹× QPT µµÀÔ ¼öÇý °ü¸®ÀÚ 08-11 19826
59 [Çѱ¹ÅõÀÚÁõ±Ç] µð¿£¿¡ÇÁ, 1Q17 ¸®ºä: ´Ù½Ã ¾²´Â 3D NAND ¼ºÀå °ü¸®ÀÚ 05-16 19763
58 [Çϳª´ëÅõÁõ±Ç] µð¿£¿¡ÇÁ, ¼ºÀåÀÇ ¿¬¼Ó °ü¸®ÀÚ 07-16 19726
57 [½ÅÇѱÝÀ¶ÅõÀÚ] 3D Nand¿Í DRAM 20nm ºñÁß Áõ°¡·Î ¼ºÀå °ü¸®ÀÚ 02-12 19708
56 [½ÅÇѱÝÀ¶ÅõÀÚ] ¿ìÈ£ÀûÀΠȯ°æ¿¡¼­ Áö¼ÓµÇ´Â ¼ºÀå (TP 34,000) °ü¸®ÀÚ 05-27 19672
55 [´ë½ÅÁõ±Ç] µð¿£¿¡ÇÁ, ¹Ï°í µû¶ó°©´Ï´Ù (TP 19,000¿ø) °ü¸®ÀÚ 09-30 19660
54 [Çѱ¹ÅõÀÚÁõ±Ç] µð¿£¿¡ÇÁ, ¼ÒÀç ±¹»êÈ­ÀÇ ¼º°øÀû »ç·Ê °ü¸®ÀÚ 03-31 19622
53 [¸Þ¸®Ã÷Á¾±ÝÁõ±Ç] µð¿£¿¡ÇÁ (TP 17,000) °ü¸®ÀÚ 05-23 19567
52 [´ë½ÅÁõ±Ç] µð¿£¿¡ÇÁ, 2Q16: DRAM ¾çÈ£, NAND ºÎÁø (TP 18,000¿ø¡¦ °ü¸®ÀÚ 08-17 19501
51 [¸Þ¸®Ã÷Á¾±ÝÁõ±Ç] µð¿£¿¡ÇÁ ¸Å¼ö Àû±â(TP 30,000) °ü¸®ÀÚ 03-18 19475
50 [À¯ÁøÅõÀÚÁõ±Ç] µð¿£¿¡ÇÁ_3Q 15 Preview(TP 28,000) °ü¸®ÀÚ 10-12 19437
49 [½ÅÇѱÝÀ¶ÅõÀÚ] µð¿£¿¡ÇÁ_º¯°îÁ¡(TP 27,000) °ü¸®ÀÚ 10-12 19391
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