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123 (ÁÖ)µð¿£¿¡ÇÁ ±â¼úºÐ¼®º¸°í¼­ (2020) °ü¸®ÀÚ 01-10 5086
122 (ÁÖ)µð¿£¿¡ÇÁ ±â¼úºÐ¼®º¸°í¼­ (2019) °ü¸®ÀÚ 04-11 9861
121 [Çѱ¹ÅõÀÚÁõ±Ç] µð¿£¿¡ÇÁ 3Q review: ¾Æ½¬¿î ¼öÀͼº. ÇÏÁö¸¸ ¼º¡¦ °ü¸®ÀÚ 11-15 16957
120 [´ë½ÅÁõ±Ç] µð¿£¿¡ÇÁ 3Q15 ¸®ºä: ¼Óµµ´Â ´ÊÁö¸¸ ¹æÇâÀº ±×´ë·Î (¡¦ °ü¸®ÀÚ 10-20 16986
119 [¸Þ¸®Ã÷Á¾±ÝÁõ±Ç] µð¿£¿¡ÇÁ_DRAM °ø±ÞÁ¶Àý¿¡µµ ¹Ì¼¼È­´Â Áö¼ÓµÈ¡¦ °ü¸®ÀÚ 10-12 17282
118 [HMCÅõÀÚÁõ±Ç] µð¿£¿¡ÇÁ_3ºÐ±â ½ÇÀû_°ú´ëÇÑ ¿ì·Á´Â ¸Å¼ö ±âȸ(TP¡¦ °ü¸®ÀÚ 10-20 17300
117 [´ë½ÅÁõ±Ç] µð¿£¿¡ÇÁ 3Q review: ¿Ï¸¸ÇÑ ÀÌÀÍ °³¼±ÀÌ ¾Æ½±´Ù °ü¸®ÀÚ 11-15 17514
116 [Çö´ëÁõ±Ç] ÀÌÀÍ È®´ë Ãß¼¼´Â °ßÁ¶ (TP 33,000) °ü¸®ÀÚ 07-15 17641
115 [Credit Suisse] DNF_3D NAND materials growth to more than of¡¦ °ü¸®ÀÚ 07-11 17828
114 [HSBC] DNF_Higher gearing to 3D NAND °ü¸®ÀÚ 08-16 17963
113 [À¯ÁøÅõÀÚÁõ±Ç] ¹ÝµµÃ¼¾÷Ȳ È£Á¶¿Í °í°´»ç ½Å±Ô¶óÀÎ °¡µ¿È¿°ú·Î ¡¦ °ü¸®ÀÚ 05-15 18041
112 [´ë½ÅÁõ±Ç] µð¿£¿¡ÇÁ, NAND ¼ÒÀç °ø±Þ»ç·Î º¯½Å Áß °ü¸®ÀÚ 08-16 18047
111 [»ï¼ºÁõ±Ç] µð¿£¿¡ÇÁ_¸·¿¬ÇÑ ÇÒÀÎÀÌ ÁÖ´Â ±âȸ(N/R) °ü¸®ÀÚ 10-21 18057
110 [´ë½ÅÁõ±Ç] ¼ÒÀç°¡ ¹Ù²î¸é ¼¼»óÀÌ ¹Ù²ï´Ù (TP 27,000) °ü¸®ÀÚ 06-08 18069
109 [À¯ÁøÅõÀÚÁõ±Ç] 1Q15 ½ÃÀ忹»óÄ¡ »óȸ - 2Q15 ½ÇÀû È£Á¶¼¼ Áö¼Ó¡¦ °ü¸®ÀÚ 04-14 18088
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