Barrier Metal

Barrier metal is required for preventing the migration of metal ion and O2 into dielectric regions during metallization, so it is called diffusion barrier materials. It is increasingly important to semiconductor device scaling because metallization metals such as Al and Cu easily react with dielectric materials, and it causes semiconductor device to lose reliability.

PRODUCT

4MS

Tetramethylsilane

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Ru(EtCp)2

Bis(ethylcyclopentadienyl)Ruthenium

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Ru-4

Ru(η6-p-Cymene)(η4-1,3-cyclohexadiene)

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TBTDETa

(t-butylimido)tris(diethylamido)Tantalum

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TBTEMTa

(t-butylimido)tris(ethylmethylamido)Tantalum

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TDMAT

Tetrakis(dimethylamido)titanium(IV)

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TiCl4

Titanium tetrachloride

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