High-k for Capacitor

High-k dielectric material is required for obtaining sufficient cell capacitance because of high density and scaling down in DRAM. ZrO2 and HfO2 are mainly used for DRAM device below 30nm.

* High dielectric constant k value makes DRAM lose capacitance less.

PRODUCT

A2HP7

Tris(dimethylamido)Zirconium cyclopentadienide

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Cp(Me)CpZr(OEt)2

(cyclopentadienyl)(methylcyclopentadienyl) Zirconium Bis(ethoxide)

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TBTDEN

Tris(diethylamido)(tert-butylimido)niobium(V)

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TEMAHf

Tetrakis(ethylmethylamido)Hafnium

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TEMAZr

Tetrakis(ethylmethylamido)Zirconium

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TMA

Trimethylaluminium

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